0 Technical & Specifications   Base material：FR4、PI、PET、PE Thickness of base copper：9µm/12µm/18µm/35µm/70µm Largest size：406mm x 610mm(16" x 24") Min. hole diameter of drilling：ø 0.2mm / 0.008" Min. hole diameter of punching：ø 0.5mm / 0.008" Min. Trace width / Min. Space：0.050~0.075 (2~3mil) Largest size：406x610mm /16" x 24" Peeling strength：1.0kg.f /cm Solder heat Temp Polyimide：280°C / 10sec Polyester：243°C / 5sec Surface Treatment Gold plating：0.025µm~1.25µm Immersion Gold：0.025µm~0.1µm Tin/Lead Plating：Min.100µ" H.A.L.：40µ "~ 800 "µ Entek Immersion Tin：10µ" ~ 20µ" Tin Plating：60µ"~ 500µ" Dimension Tolerances Conductor Width：±0.025mm Accumulated Pitch：±0.05mm Outline Dimension：±0.1mm Apply Coverlay Tolerance：±0.3~0.5mm Hole Diameter：±0.05mm 1µm=1 micrometer=1micron, is 0.000001 meter. (c)1mm=1 millimeter is 0.001 meter. (d)mil