FPC with components
|
Base material |
PI (Polyimide) |
|
Thickness of base copper |
18µm/35µm (standard thickness) |
|
Largest size |
Single Sided-550mmx250mm Double Sided-500mmx250mm |
|
Min. hole diameter of drilling |
ø0.15mm/ 6mil |
|
Min. hole diameter of punching |
ø0.5mm/ 20mil |
|
Min. Trace width / Min. Space |
0.075mm (3mil) |
|
Peeling strength |
1.0kg.f /cm |
|
Multi-layers |
Up to 4 layers |
|
Passive Component |
Min. 0201 |
|
Connector |
Min. Pitch0.3mm |
|
Stiffener |
PI (Polyimide), PET (Polyester), FR4, Metal |
|
Solder heat Temp |
PI (Polyimide) ：250°C / 10sec |
|
Surface Treatment |
Gold plating：Ni:1um~4um + Au:0.05um~0.1um Immersion Gold：Ni:1um~4um ; Au:0.03um~0.09um OSP Immersion Tin：2µ" ~ 40µ" Tin Plating：200µ"~1000µ" |
|
Dimension Tolerances |
Conductor Width：±0.03mm~±0.05mm Outline Dimension：±0.1mm~±0.03mm Apply Coverlay Tolerance：±0.3~0.5mm Hole Diameter：±0.1mm |
|
Finish products testing |
ICT (In Circuit Test): proceed testing for SMT components to make sure the components locations are correct.
FCT (Function Test): proceed testing after SMT, but need customer provide us the fixture or machine. |
